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A Day with the Huawei Mate 30 Pro: Kirin 990 and 7680 FPS Slow Motion Tests
Last week Huawei launched its latest flagship smartphone, the Mate 30 Pro, featuring its latest Kirin 990 chipset. At the heart of the new hardware is a waterfall wrap-around...
47 by on 9/23/2019
AMD: Next Gen Threadripper and Ryzen 9 3950X, Coming November
In a shock email late on Friday, AMD has released a statement to clarify the situation it is in with the manufacturing of its latest Ryzen processors. And, depending...
82 by on 9/20/2019
The Huawei Mate 30 Launch Event Live Blog (Starts at 8am ET/12:00 UTC)
The busy fall period for smartphone launches continues. Today in Munich, Germany, Huawei is holding their launch event for their Mate 30 family of smartphones, the latest generation of...
15 by on 9/19/2019
AMD’s New 280W 64-Core Rome CPU: The EPYC 7H12
If there’s something that gets everyone excited, it is more performance. On the Enterprise side, AMD has made big strides with its latest EPYC processor stack, featuring up to...
54 by on 9/18/2019
Reaching for Turbo: Aligning Perception with AMD’s Frequency Metrics
For those that keep a close eye on consumer hardware, AMD recently has been involved in a minor uproar with some of its most vocal advocates about the newest...
144 by on 9/17/2019
New Uses for Smartphone AI: A Short Commentary on Recording History and Privacy
This opinion piece is reactionary to recent announcements. Having just attended the Huawei keynote here at the IFA trade show, there were a couple of new features enabled through AI...
25 by on 9/6/2019
Huawei Announces Kirin 990 and Kirin 990 5G: Dual SoC Approach, Integrated 5G Modem
For the last 3 years, Huawei has announced its next generation SoC at the IFA technology show here in Berlin. In every occasion, the company promotes its hardware, using...
153 by on 9/6/2019
TCL Waterfall Tech Demo: Screen Edges Done Right
Modern edge display technology is a compromise between screen real estate, comfort, and aesthetics. Personally, I’ve never owned a Note, or a device with an excessive edge with edge-related...
31 by on 9/5/2019
The TCL One Piece Tech Demo: The Smartphone with No Holes and No Buttons
One of the things I love about TCL is its willingness to show off internal conceptual designs to the press. It’s something we see in the car industry all...
18 by on 9/5/2019
The TCL Plex Smartphone Hands-On: Dedicated Low-Light Camera for Video
As one of the world’s largest TV manufacturers, with its hands in a lot of other things, TCL is a fairly common name among certain regions of the world...
20 by on 9/5/2019
Xilinx Announces World Largest FPGA: Virtex Ultrascale+ VU19P with 9m Cells
We don’t often cover the FPGA market here at AnandTech, but in the past couple of years we have seen the array of features that FPGAs are implementing expand...
17 by on 8/27/2019
Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon
The final presentation of Hot Chips 31 is from Microsoft, who will be lifting the lid of the silicon behind its HoloLens 2.0 product.
9 by on 8/20/2019
Hot Chips 31 Live Blogs: Intel/Tsinghua Xeon Jintide Security CPU
Doing custom x86 CPUs is nothing new: presenting one at Hot Chips is new. Here we have Tsinghua University giving a presentation on Jintide, its custom solution built upon...
10 by on 8/20/2019
Hot Chips 31 Live Blogs: Intel Lakefield and Foveros
One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is...
31 by on 8/20/2019
Hot Chips 31 Live Blogs: Gen-Z Chipset for Exascale Fabric
One of the key competing interconnects of the future is Gen-Z, and Hewlett Packard Enterprise have a Gen-Z chipset to show at Hot Chips today.
5 by on 8/20/2019
Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)
The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...
12 by on 8/20/2019
Hot Chips 31 Live Blogs: Intel 10nm Spring Hill NNP-I Inference Chip
One of Intel's future 10nm products is the Spring Hill NNP-I 1000 Inference Engine. Today the company is lifting the lid on some of the architecture behind the chip.
3 by on 8/20/2019
Hot Chips 31 Live Blogs: Xilinx Versal AI Engine
Xilinx, the manufacturer of FPGAs, announced its new Versal AI engine last year as a way of moving FPGAs into the AI domain. This talk is set to expand...
19 by on 8/20/2019
Hot Chips 31 Live Blogs: NVIDIA Multi-Chip AI Accelerator at 128 TOPS
NVIDIA announced at a VLSI conference last year that it had designed a test multi-chip solution for DNN computations. The company is explaining the technology today at Hot Chips...
2 by on 8/20/2019
Hot Chips 31 Live Blogs: Tesla Solution for Full Self Driving
The first talk being live blogged at Hot Chips today is from Tesla, who are showing off their compute and redundancy solution for a fully-self driving car. We assume...
4 by on 8/20/2019
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