Yesterday Intel and Micron shared some new details of their 3D NAND technology and during the presentation they also showed a production wafer. I missed the wafer during the live broadcast (hence I couldn't include this in the initial write up), but fortunately Intel-Micron have now posted the recorded webinar, which I used to get a pretty good shot of the wafer. The quality isn't perfect, but it's good enough that I was able to make a fairly accurate estimation of the die size. Disclaimer: The data and analysis presented in this article is based on estimations that are provided "as is" with no guarantee of full accuracy. I calculated 19 dies vertically and 25 horizontally, which would yield a die size of 189.5mm. That's...

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6 by Kristian Vättö on 1/5/2015

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18 by Kristian Vättö on 1/4/2015

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38 by Kristian Vättö on 12/15/2014

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62 by Kristian Vättö on 12/12/2014

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88 by Kristian Vättö on 12/8/2014

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58 by Kristian Vättö on 11/25/2014

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57 by Kristian Vättö on 11/17/2014

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10 by Kristian Vättö on 11/11/2014

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67 by Kristian Vättö on 10/21/2014

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94 by Kristian Vättö on 10/16/2014

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56 by Kristian Vättö on 9/29/2014

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84 by Kristian Vättö on 9/26/2014

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116 by Kristian Vättö on 9/19/2014

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52 by Kristian Vättö on 9/16/2014

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15 by Kristian Vättö on 9/16/2014

PCIe SSD Faceoff: Samsung XP941 (128GB & 256GB) and OCZ RevoDrive 350 (480GB) Tested

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46 by Kristian Vättö on 9/5/2014

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31 by Kristian Vättö on 9/3/2014

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49 by Kristian Vättö on 8/28/2014

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54 by Kristian Vättö on 8/26/2014

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