ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel
by Anton Shilov on March 5, 2020 11:00 AM EST
ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to 128 GB. The modules are available in various form-factors and configurations to address a variety of designs.
ATP’s family of server/embedded/industrial DDR4-3200 at 1.2 V memory modules are validated to work with AMD’s EPYC 7002-series as well as Intel’s 2nd Generation Xeon Scalable CPUs, and are ready for AMD’s upcoming Milan and Genoa CPUs, as well as Intel’s Cooper Lake and Ice Lake processors. ATP uses a variety of certified memory chips for different modules featuring capacities ranging from 2 GB to 128 GB (e.g., the former uses 4 Gb chips, whereas the latter relies on 16 Gb dies).
The industrial-grade modules from ATP use special PCBs featuring thicker gold contacts, PCB underfill, conformal coating, and anti-sulfur resistors that are meant to protect DIMMs from shock/vibration, electromagnetic disturbance, humidity, and harsh chemicals in the air. Also, like other industrial components they are rated for extreme temperatures from –40°C to +85°C. Last but not least, these modules undergo module-level test during burn-in (TDBI) to reveal weak DIMMs that can produce errors.
Given that ATP’s family of DDR4-3200 at 1.2 V modules for server/embedded/industrial are aimed at a variety of designs, they come in LRDIMM, RDIMM, UDIMM, UDIMM ECC, SO-RDIMM, SO-DIMM, SO-DIMM ECC, Mini-RDIMM, and Mini-UDIMM ECC form-factors. Meanwhile, unbuffered DDR4-3200 modules are available in SO-DIMM, UDIMM, ECC UDIMM, ECC SO-DIMM, and RDIMM configurations.
The new DDR4-3200 DIMMs from ATP are expected to be available shortly, at prices that will depend on configurations and form-factors.
Related Reading:
- Transcend Introduces Extreme Temperature DDR4 SO-DIMMs
- ATP Unveils N600S-Series Industrial SSDs w/ MCU-Based Power Loss Protection
- ATP Launches M.2 NVMe SSDs: 3D MLC, SMI, Extreme Temps, Up to 2.5 GB/s
- ATP Announces eMMC5.1 3D NAND Storage For Extreme Temperatures
Source: ATP
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Dr.Neale - Thursday, March 5, 2020 - link
Finally, some nice ECC UDIMMs rated at DDR 3200 for AMD systems! Yay!antonkochubey - Friday, March 6, 2020 - link
I doubt UDIMM's will go up to 128, most likely UDIMM's will be up to 32 and RDIMM's will be up to 128 (as is the case already, for over a year)Foeketijn - Saturday, March 7, 2020 - link
But now at 3200 instead of 2667.Dr.Neale - Thursday, March 5, 2020 - link
Finally, some nice ECC UDIMMs rated at DDR4 3200 for AMD systems! Yay!Dr.Neale - Thursday, March 5, 2020 - link
Too bad there's no way to edit out a typo, just re-do it right, like here!Brane2 - Thursday, March 5, 2020 - link
Article says nothing. TZhey will offer some modules lying between capacity extreemes ( 2-128GB), wide frequency range ( 2133-3200Mhz), in voarious shapes and forms ( ECC, unbuffered etc).Nothing about actual models etc.
Dragonstongue - Thursday, March 5, 2020 - link
shame they not offer "standard" 3200 class for "other than" industrial, maybe there could be a "unique" new player on/in the global market place..I suppose depends on the timings, but still 1.2v for 3200 class sounds excellent, even if it means the "chips" are left bare (no spreader)(^.^)
That is a heck of a bunch of different categories offered though, I can only assume being "industrial" these are likely to be anything BUT low "reasonable" cost...16-32gb per stick would be awesome though, I believe the "upper limit" sits ~64gb (for the most part) for average desktop user (Intel or AMD) modern socket of course, where the 128gb would be more along the HEDT lines
Not that I can afford any of those levels
ha .... ukkk