Hot Chips 2020 Live Blog: Intel/Barefoot Tofino2 12.9 Tbps Switch (10:30am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
2 by Dr. Ian Cutress on 8/18/2020
Hot Chips 2020 Live Blog: Xilinx Versal ACAPs (9:00am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
2 by Dr. Ian Cutress on 8/18/2020
Hot Chips 2020 Live Blog: Intel 10nm Agilex FPGAs (8:30am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
9 by Dr. Ian Cutress on 8/18/2020
342 Transistors for Every Person In the World: Cerebras 2nd Gen Wafer Scale Engine Teased
One of the highlights of Hot Chips from 2019 was the startup Cerebras showcasing its product – a large ‘wafer-scale’ AI chip that was literally the size of a...
32 by Dr. Ian Cutress on 8/18/2020
Lenovo Refreshes the Yoga Lineup With Ryzen and Next-Gen Intel Core Processors
There are several iconic designs in the PC space that have spawned many competing clones, and Lenovo is the proud parent of one such design in the Lenovo Yoga...
43 by Brett Howse on 8/18/2020
SK Hynix Launches First 128 Layer 3D NAND SSD: Gold P31 NVMe
Last year SK Hynix re-entered the consumer retail SSD market with their Gold S31 SATA SSD. At CES 2020, they previewed a pair of consumer NVMe drives, the first...
20 by Billy Tallis on 8/18/2020
Spotted At Hot Chips: Quad Tile Intel Xe-HP GPU
At last week’s Intel Architecture Day, Intel’s chief architect, Raja Koduri, briefly held up the smallest member of the company’s forthcoming Xe-HP series of server CPUs, the one tile...
28 by Ryan Smith on 8/17/2020
Hot Chips 2020 Live Blog: Alibaba Xuantie-910 RISC-V CPU (3:00pm PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
6 by Dr. Ian Cutress on 8/17/2020
Hot Chips 2020 Live Blog: AMD Ryzen 4000 APU (Noon PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
15 by Dr. Ian Cutress on 8/17/2020
Hot Chips 2020 Live Blog: IBM z15, a 5.2 GHz Mainframe CPU (11:00am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
21 by Dr. Ian Cutress on 8/17/2020
Hot Chips 2020 Live Blog: Marvell ThunderX3 (10:30am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
6 by Dr. Ian Cutress on 8/17/2020
Intel Brand Tie-ins: New Avengers Packaging Gives You a New Box To Play With
When buying a new processor, what’s the first thing to look for? Price? Performance? Frames per Second? The Box? Intel’s new brand tie-in with Marvel’s Avengers now seems official...
64 by Dr. Ian Cutress on 8/14/2020_carousel.jpg)
Intel Next-Gen 10-micron Stacking: Going 3D Beyond Foveros
One of the issues facing next-generation 3D stacking of chips is how to increase the density of the die-to-die interface. More connections means better data throughput, reducing latency and...
32 by Dr. Ian Cutress on 8/14/2020
Intel Alder Lake: Confirmed x86 Hybrid with Golden Cove and Gracemont for 2021
Following leaks is often a game of cat and mouse – what is actually legitimate and what might not be. Traditionally AnandTech shies away from leaks for that very...
89 by Dr. Ian Cutress on 8/14/2020
MMD and Phillips Launch the 279C9 27" Montior: FreeSync 4K IPS & USB Type-C
This week MMD and Phillips have unveiled its latest display in their ever-growing product range, the Phillips 279C9. A 27-inch monitor aimed squarely at content creators and professionals, the...
28 by Gavin Bonshor on 8/14/2020
Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology
Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs. Current...
21 by Andrei Frumusanu on 8/14/2020
Intel Xe-HPC GPU Status Update: 4 Process Nodes Make 1 Accelerator
Continuing today’s GPU news from Intel’s Architecture Day presentation, on top of the Xe-LP architecture briefing and Xe-HPG reveal, the company has also offered a brief roadmap update for...
20 by Ryan Smith on 8/13/2020
Intel’s Xe-HPG GPU Unveiled: Built for Enthusiast Gamers, Built at a Third-Party Fab
Among the many announcements in today’s Intel Architecture Day, Intel is also offering a major update to their GPU roadmap over the next 24 months. The Xe family, already...
39 by Ryan Smith on 8/13/2020
Intel Previews 4-Layer 3D XPoint Memory For Second-Generation Optane SSDs
As part of Intel's Architecture Day 2020 presentations, Raja Koduri spent a bit of time talking about the status of their Optane products. Most of it was a recapitulation...
27 by Billy Tallis on 8/13/2020
Microsoft Opens Pre-Orders for Surface Duo - US Only
Late last year in October, Microsoft had announced the Surface Duo, the company’s first ever Android device and first-party smartphone (if you can call it that) release in years...
71 by Andrei Frumusanu on 8/12/2020
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