TSMC
Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to both improve productivity/uptime, and to cut down on the costs of using the ultra-fine tools. As part of the company's European Technology Symposium this week, they went into a bit more detail on their EUV usage history, and their progress on further integrating EUV into future process nodes. When TSMC started making chips using EUV lithography in 2019 on its N7+ process (for Huawei's HiSilicon), it held 42% of the...
TSMC: We Want OSATs to Expand Their Advanced Packaging Capability
Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would...
2 by Anton Shilov on 10/16/2023
TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...
20 by Anton Shilov on 10/12/2023
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by Anton Shilov on 10/12/2023
TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better...
4 by Anton Shilov on 10/12/2023
TSMC Buys 10% Stake in IMS Nano from Intel
Intel and TSMC have announced an agreement in which TSMC will acquire a 10% stake in IMS Nanofabrication. IMS, controlled by Intel, produces multi e-beam photomask writing tools, whose...
0 by Anton Shilov on 9/12/2023
TSMC: Short Supply of HPC GPUs to Persist for 1.5 Years
The reports about an insufficient supply of compute GPUs used for artificial intelligence (AI) and high-performance computing (HPC) servers became common in recent months as demand for GPUs to...
6 by Anton Shilov on 9/7/2023
ASML to Deliver First High-NA EUV Tool This Year
In a promising sign for the development of the next generation of EUV lithography machines, ASML has revealed that the company is set to deliver the industry's first High-NA...
7 by Anton Shilov on 9/6/2023
TSMC Establishes Joint Venture to Build 12nm/16nm Fab in Europe
TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany...
10 by Anton Shilov on 8/8/2023
Dozens of Companies Adopt TSMC's 3nm Process Technology
Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures...
9 by Anton Shilov on 7/28/2023
TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that...
3 by Anton Shilov on 7/25/2023
TSMC: 3nm Chips for Smartphones and HPCs Coming This Year
While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in...
21 by Anton Shilov on 7/21/2023
TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers
TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...
27 by Anton Shilov on 7/20/2023
Top 10 Foundries See Revenue Drop Nearly 15% Year-over-Year
The top 10 contract makers of chips saw their Q1 2023 revenue decline by 14.6% year-over-year and 18.6% quarter-over-quarter, according to the most recent report by TrendForce. The market...
0 by Anton Shilov on 6/13/2023
TSMC Opens Advanced Backend Packaging Fab for AI and HPC Products
TSMC on Friday formally opened its Advanced Backend Fab 6 facility, which it will be using to expand the company's capacity for building high-end, multi-chiplet products. The facility is...
1 by Anton Shilov on 6/9/2023
TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed
TSMC has revealed some additional details about its upcoming N2 and N2P process technology at its European Technology Symposium 2023. Both production nodes are being developed with high-performance computing...
15 by Anton Shilov on 5/31/2023
TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors
As part of their efforts to push the boundaries on the largest manufacturable chip sizes, Taiwan Semiconductor Manufacturing Co. is working on its new Chip-On-Wafer-On-Substrate-L (CoWoS-L) packaging technology that...
2 by Anton Shilov on 5/26/2023
TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage
At its 2023 Technology Symposium TSMC revealed some additional details about its upcoming N4X technology that is designed specifically for high-performance computing (HPC) applications. This node promises to enable...
5 by Anton Shilov on 5/26/2023
TSMC: We Have Working CFET Transistors in the Lab, But They Are Generations Away
Offering an update on its work with complementary field-effect transistors (CFETs) as part of the company's European Technology Symposium 2023, TSMC has revealed that it has working CFETs within...
3 by Anton Shilov on 5/25/2023
TSMC Announces Early Access Nodes for Next-Gen Car Chips: N4AE and N3AE
As the final set of announcements from this week's North American Technology Symposium, TSMC closed out their fab roadmap updates with some fresh news on their automotive-centric processes. For...
10 by Anton Shilov on 4/28/2023
TSMC Details 3nm Evolution: N3E On Schedule, N3P and N3X To Deliver 5% Performance Gains
Alongside some new announcements for their 2nm process node plans, TSMC has also released a progress and roadmap update for their N3 family process technologies at today's 2023 North...
13 by Anton Shilov on 4/26/2023
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